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    AI Hardware№ 000 / 2026

    NVIDIA Blackwell Ultra Chips Power Next-Gen AI Data Centers

    New B300 Ultra accelerators deliver 10x inference performance, as hyperscalers race to deploy for AI model training and serving.

    NVIDIA Blackwell Ultra Chips Power Next-Gen AI Data Centers

    AI Hardware
    6 min readLIVE

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    NVIDIA has begun shipping Blackwell Ultra B300 accelerators to major hyperscalers, delivering the most significant performance leap in AI infrastructure. The new chips power next-generation data centers optimized for large language model training and inference.

    Performance Specifications

    The B300 Ultra features 208 billion transistors, 192GB of HBM3e memory, and delivers 10 exaflops of AI compute per chip. Compared to the H100, inference performance improves by 10x for large language models while energy efficiency improves by 4x.

    The new NVLink Switch enables scaling to 10,000+ GPUs in a single training cluster. This enables training runs for models exceeding 1 trillion parameters with unprecedented efficiency.

    Customer Deployments

    Microsoft Azure, Amazon AWS, and Google Cloud have all announced B300 Ultra availability. Microsoft's deployment powers enhanced Azure OpenAI services, while AWS offers the chips through SageMaker and Bedrock.

    Blackwell Ultra architecture diagram

    Jensen Huang, NVIDIA CEO, stated: 'Blackwell Ultra is our greatest architectural leap ever. We're enabling AI systems that were impossible just a year ago.'

    Supply and Demand

    NVIDIA projects $100 billion in data center revenue for fiscal 2027, with Blackwell representing the majority of shipments by mid-year. Demand continues to exceed supply, with hyperscalers placing orders through 2027.

    Taiwan Semiconductor's advanced packaging capacity remains the primary bottleneck. NVIDIA has secured priority allocation but lead times extend 6-9 months for new orders.

    Hyperscaler AI data center with NVIDIA chips

    Key Takeaways

    Blackwell Ultra delivers 10x inference improvement over H100 for LLMs. 208 billion transistors and 192GB HBM3e memory per chip. Major hyperscalers deploying for AI model training and serving. Demand continues to exceed supply through 2027.

    Related: [AI Hub](/ai) • [AI Hardware Coverage](/topics/ai-hardware)

    #NVIDIA#Blackwell#GPU#AI chips#data centers#machine learning#infrastructure

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    This article was researched and written by human editors with analytical assistance from AI tools. All conclusions are independently reviewed.

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